[Source: "High-tech LED Research Review" August issue GLII]
According to the latest report of packaging equipment released by the High-tech LED Industry Research Institute (GLII), in the first half of 2012, based on the growth of market demand, the capacity of some domestic packaging companies continued to expand, and some other enterprises also had plans to expand production. Especially since March, the growth rate of LED packaging equipment manufacturers' shipments has obviously accelerated. However, due to the continuous decline in prices, the overall sales of domestic LED packaging equipment in the first half of the year was still lower than expected, and the growth rate in 2011 was not obvious.
Domestic sales of LED packaging equipment in the latter stage increased slightly
Compared with 2011, in the first half of 2012, the equipment introduced by packaging manufacturers was mainly based on perfect production lines. The proportion of LED packaging equipment in the first half of the year was quite different from that in the first half of 2011.
Other equipment: mainly refers to testers, vacuum equipment, ovens, electronic scales, mixers, laboratory boxes, etc.
Among the LED packaging equipment, the combination of solid crystal machine and wire bonding machine has the largest market share, with a total of about 46-50%. In addition to the high sales price of die bonding and wire bonding equipment, it is directly related to the core position of the die bonding machine and wire bonding machine in the production line.
In the first half of 2011, the domestic LED packaging industry is still in the late stage of investment boom. Most of the equipment introduced by the company is mainly complete or front-end main equipment (solid crystal machine, wire bonding machine, dispensing machine); most of the LED packaging in the first half of 2012 The expansion of the enterprise is basically based on the replacement of old equipment or the addition of some equipment. The main equipment of the back end (beam splitter, taping machine) is the part that is updated or added in the first half of the year.
GLII expects that the proportion of major packaging equipment (beam splitter and taping machine) will increase from 31% in 2011 to 35.6% in the latter part of 2012; the main equipment in the previous stage (solid crystal machine, wire bonding machine, dispenser) The total proportion will decrease from 58.5% in the first half of 2011 to 53.9%;
Figure 1. Sales of various types of LED packaging equipment in China in the first half of 2011
The die bonding machine and the wire bonding machine are one of the core devices of the entire LED packaging equipment. Before 2010, China's LED package solid crystal and wire bonding machine market was dominated by imported equipment such as ASM and K&S. After rapid development in recent years, it was represented by Cui Tao, Dazu Optoelectronics, Youguang Advanced, Xinyichang, etc. A number of domestic equipment companies have risen rapidly, and the overall market share has increased rapidly.
In the first half of 2012, as the overall performance of domestic solid crystal machines and wire bonding machines could not be compared with imported equipment, most LED packaging companies still favor imported equipment. The overall market share of domestic solid crystal and wire bonding machines is only 32%.
In the first half of 2012, ASM, K&S and K9 accounted for more than 85% of the market share of solid crystal machines and wire bonding machines. Among the domestic equipment enterprises, Cuitao Automation, Xinyichang, Youguang, and Dazu Optoelectronics, which account for a relatively large market share, account for about 70% of domestic equipment.
Domestic split-light separation machine, taping machine sales accounted for nearly 50%
According to GLII data, as of June 2012, there are more than 50 domestic LED splitter and tape machine equipment manufacturers, but the total sales volume is still slightly lower than that of imported equipment manufacturers.
According to the latest report of packaging equipment released by the High-tech LED Industry Research Institute (GLII), in the first half of 2012, based on the growth of market demand, the capacity of some domestic packaging companies continued to expand, and some other enterprises also had plans to expand production. Especially since March, the growth rate of LED packaging equipment manufacturers' shipments has obviously accelerated. However, due to the continuous decline in prices, the overall sales of domestic LED packaging equipment in the first half of the year was still lower than expected, and the growth rate in 2011 was not obvious.
Domestic sales of LED packaging equipment in the latter stage increased slightly
Compared with 2011, in the first half of 2012, the equipment introduced by packaging manufacturers was mainly based on perfect production lines. The proportion of LED packaging equipment in the first half of the year was quite different from that in the first half of 2011.
Other equipment: mainly refers to testers, vacuum equipment, ovens, electronic scales, mixers, laboratory boxes, etc.
Among the LED packaging equipment, the combination of solid crystal machine and wire bonding machine has the largest market share, with a total of about 46-50%. In addition to the high sales price of die bonding and wire bonding equipment, it is directly related to the core position of the die bonding machine and wire bonding machine in the production line.
In the first half of 2011, the domestic LED packaging industry is still in the late stage of investment boom. Most of the equipment introduced by the company is mainly complete or front-end main equipment (solid crystal machine, wire bonding machine, dispensing machine); most of the LED packaging in the first half of 2012 The expansion of the enterprise is basically based on the replacement of old equipment or the addition of some equipment. The main equipment of the back end (beam splitter, taping machine) is the part that is updated or added in the first half of the year.
GLII expects that the proportion of major packaging equipment (beam splitter and taping machine) will increase from 31% in 2011 to 35.6% in the latter part of 2012; the main equipment in the previous stage (solid crystal machine, wire bonding machine, dispenser) The total proportion will decrease from 58.5% in the first half of 2011 to 53.9%;
Figure 1. Sales of various types of LED packaging equipment in China in the first half of 2011
Source: Gaogong LED Industry Research Institute (GLII)
The die bonding machine and the wire bonding machine are one of the core devices of the entire LED packaging equipment. Before 2010, China's LED package solid crystal and wire bonding machine market was dominated by imported equipment such as ASM and K&S. After rapid development in recent years, it was represented by Cui Tao, Dazu Optoelectronics, Youguang Advanced, Xinyichang, etc. A number of domestic equipment companies have risen rapidly, and the overall market share has increased rapidly.
In the first half of 2012, as the overall performance of domestic solid crystal machines and wire bonding machines could not be compared with imported equipment, most LED packaging companies still favor imported equipment. The overall market share of domestic solid crystal and wire bonding machines is only 32%.
In the first half of 2012, ASM, K&S and K9 accounted for more than 85% of the market share of solid crystal machines and wire bonding machines. Among the domestic equipment enterprises, Cuitao Automation, Xinyichang, Youguang, and Dazu Optoelectronics, which account for a relatively large market share, account for about 70% of domestic equipment.
Domestic split-light separation machine, taping machine sales accounted for nearly 50%
According to GLII data, as of June 2012, there are more than 50 domestic LED splitter and tape machine equipment manufacturers, but the total sales volume is still slightly lower than that of imported equipment manufacturers.
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