Heat Dissipation Design of the Light Source The internal heat sink of the LED transfers heat to the metal circuit board through the bonding layer, which is then transmitted to the heat sink through the bonding layer and distributed to the surrounding environment. The packaging process, bonding materials, and substrate materials are the focus of the heat dissipation design of the light source. The packaging process flip chip structure is compared with the formal structure, the heat is not transmitted through the sapphire substrate, but is transferred from the solder layer to the Si substrate, and then transmitted to the metal substrate via the Si substrate and the bonding material, the structure has superior electrical properties. And thermal performance. The bonding material used for the high-power LED chip of the bonding material is generally a conductive silver paste of a curing system.
Conductive silver glue can be divided into room temperature curing conductive silver glue, medium temperature curing conductive silver glue, high temperature curing conductive silver glue, ultraviolet curing conductive silver glue and the like. With the development of technology, the nano silver layer will become the development direction of LED packaging technology due to its good thermal conductivity and simpler structure. The aluminum nitride substrate of aluminum nitride substrate has the advantages of large heat transfer coefficient, high strength and hardness, low manufacturing cost, and the thermal conductivity is generally 200 W/m. k, can greatly improve the reliability of the system, and start to apply in high-power LED packaging. LED street lamp heat dissipation structure design The general principle of LED street lamp heat dissipation structure design is: (1) the less the structural layer, the better; (2) the thinner the layer, the better; (3) the larger the layer, the better; (4) the material The larger the thermal conductivity, the better; (5) The shape of the lamp is better in a rectangular shape and a ring shape. For LED street lights, the heat dissipation scheme should adopt the principle of passive heat dissipation and active heat dissipation, with little or no use.
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