1. ATEX + IECEx Standard
  Could be used in
  Explosive atmospheres, Zone 1&2
  Explosive dust, Zone 21&22
2. Excellent lighting efficacy, up to 110 lumens per Watt (110lm/W)
3. CE, RoHS, IK08
4. AC100-277V, 50/60HzÂ
5. Heavy duty copper-free aluminum housing
6. Mounting: ceiling type, wall type, floor type
Application
1. Gas Station
2. Storage Facility
3. Manufacturing Plant
4. Marine Loading Terminals
5. Chemical Processing Facility
Specification
Â
| Electric | Rated Power | 20W-150W |
| Input Voltage       | AC90~305V | |
| Input Frequency    | 50/60Hz | |
| Output Voltage | DC36~48V/DC18~24V/DC49~58V/DC18~36V | |
| Power Factor | > 0.95 | |
| Driver Efficiency | ≥  91% | |
| DC output Ripple & Noise | <4.8mVP-P/<4.5mVP-P/<200mVP-P | |
| Optical | Luminous Flux (Lumen Output) |
2100Lm~15500Lm |
| Luminous Efficacy (Lumens per Watt) |
>100Lm/WÂ | |
| Beam Angle | 60°/110° | |
| Correlated Color Temperature (CCT) Â | 5500K | |
| CRI | Â Ra>70 | |
| Environmental | Ambient Operating Temperature |  -30°C~+50°C |
| Ambient Operating Humidity | 10%~90% RH | |
| Â | Â | |
| Altitude of installation site: | <2000m | |
| Atmospheric pressure | 86~106KPa | |
| Mechanical | Housing Material | Heavy-duty Anodized Die Casting Aluminum |
| Lens Material:Â Â Â Â Â | Tempered glass | |
| Mounting Options | Ceiling, Wall type, Hanging Chain, Floor type | |
| IP Rating | IP66 | |
| IK rating | IK08 | |
| Corrosion-proof Grade | WF2 | |
| Â | Â | |
| Cable's Spec | Φ12.5~20mm | |
| Â | Â | |
| Net Weight | 4.6 kg /10.1 lbs--12.2kg/26.9lbs | |
| Â | Â | |
| Dimensions (L×W×H) | 20~60W:              240×200×130 mm    9.4×7.9×5.1in 80~150W:             335×280×159 mm    13.2×11×6.3in      |
|
| Â | Â | |
| Gross Weight | 5.5kg/12.1lbs--13.5kg/29.8lbs | |
| Packing Dimensions (L×W×H) | 20~60W:   327×290×200 mm       12.9×11.4×7.9in 80~150W:  370×362×233 mm         14.6×14.3×9.2in                    |
|
| Â | Â | |
| Warranty | 3-year limited system warranty | |
| Lumen Maintenance: 50,000 hours@ L70 | ||
HDI circuit board is a circuit board with high circuit distribution density using micro-blind and buried via technology.The HDI board is divided into inner layer circuit and outer layer circuit, and the internal connection of each layer circuit is realized by drilling and metallization.
Therefore, the higher the application of HDI technology, the higher the manufacturing level of the laminate. Ordinary HDI boards are laminated once, and high-end HDI uses two, three or more lamination processes, as well as electroplating fill holes, stack holes, laser direct drilling, etc.
We are a large professional printed circuit board manufacturer and also have the ability to produce multi-layer HDI circuit boards.
HDI PCB Manufacturer,Multilayer HDI PCB,Blind Buried via plate,HDI Plate,ENIG Surface Finished
Huizhou Liandajin Electronic Co., Ltd , https://www.ldjcircuitboard.com