LED Packaging Technology and Future Trends

In recent years, due to the deterioration of global energy consumption and the deterioration of the environment year by year, various countries have raised their awareness of environmental protection and have successively proposed policies such as disabling incandescent light bulbs.

LED light source products have become a substitute for green energy, and new products have been continuously developed. The smaller size, higher efficiency, higher wattage, and lower price have become the future trend of LED. Traditional materials have limited the development of some parts. However, in recent years, the packaging of ceramic substrates has expanded to a wider range of advantages, enabling the development of LEDs to meet the above requirements.

What are the advantages of using ceramic substrates?

1. Suitable for mass production (high density package, effectively reduce costs)

2. Significantly increase component life (small coefficient of thermal expansion)

3. Applicable to various harsh environments (simple structure, effectively prevent moisture penetration, against large temperature changes)

4. Good heat dissipation (using aluminum nitride base plate, resulting in 2.5°C/W low thermal resistance product)

5. Overall light reduction (smaller components, smaller secondary optics)

6. Luminaire illumination is high (component luminous density is high, secondary optics is easy to converge, reaching a small-angle lighting needs)

LED Packaging Technology and Future Trends

Edison Optoelectronics has applied the above advantages to provide a range of Federal products, 3045 (FR), 3535 (FX), 5050 (FM), etc., from 1W to 10W solutions, both indoor and outdoor lighting, automotive Warning lights, stage lighting applications, landscape lighting, nighttime monitors, and even plant growth lights all provide suitable products. In addition to high efficiency and high quality, prices are also quite competitive.

In white light models, 120lm equivalent to 110lm/W can be provided, and other monochromatic light series can also provide products comparable to international manufacturers.

LED Packaging Technology and Future Trends

In addition to relying on ceramic substrates to achieve the aforementioned advantages, a new generation of LED products can be combined with EutecTIc (eutectic) technology to make crystals longer and have a higher luminous surface area.

Co-crystal (AuSn) VS Silver Glue

material High thermal conductivity silver glue Gold tin alloy
Process Silver glue solid crystal Eutectic
Thermal conductivity
(W/mK)
10 - 30 58
Expansion coefficient (μm/mK) 54 16


High-brightness LED future trends

Since 2009, the LED light source products used in LED lighting have attracted much attention. Due to features such as energy saving, high efficiency, no mercury, long life, etc., they gradually began to thrive and received attention from all walks of life.

Therefore, in 2010 one after another manufacturers joined the ranks of LED lighting applications, whether it is a chip factory, a packaging plant and a lamp factory ... etc., but due to the expansion is too fast, the European downturn and too many LED quality is uneven, resulting in 2011, LED has The situation of oversupply has lowered the gross profit and the selling price of finished products has also dropped by 20-30% during the year.

Looking forward to 2012, all countries in the world, including the United States, China, South Korea, and Taiwan, are committed to accelerating the development of national and industry standards.

The LED manufacturers with poor constitution will face the fate of closure and merger, which will increase the confidence of consumers (including government, general enterprises and consumers). As incandescent light bulbs are banned in 2012, LED lighting talent network The market grows at multiples, and then after the reshuffle of the 2012 industry, after 2013, lighting LED will reach a certain level in terms of price, quality and efficiency, so that the demand for LED will grow rapidly, and every household will switch to LED. The times are not far away.

Coaxial Power D-Sub Solder Cup

Coaxial Power D-Sub Solder Cup Contacts with Mixed or Full Layout
Transmit Radio Frequency Signals

The Coaxial D-Sub have like the Power D-Subr replaced the two rows in a Standard Density connector with a coaxial contact that take up about the same size as the two rows of signal contacts. The Coaxial D-Sub is exactly the same size as the Standard Density connector but instead of example 9 positions of signal pins it has 2 power contacts , or instead of 37 positions of signals it has 8 coaxial contacts.

The Impedance for the coaxial contacts are 50Ω or 75Ω


All Signals, but different Signals
The Coaxial D-Sub with Mixed Layout mixes both coaxial contacts and signal contacts in the same connector. For example the same size as a 15 position Standard Density D-Sub you can have what we call a 7W2, which means there is 7 contacts where 2 of them are coaxial contacts, which means there are 5 signal contacts, so 5 signals and 2 coaxial. See the Layout in the Tech Specs on the bottom, there are a lot of combinations of the Mixed Layout alternative.


Antenk's Coaxial D-Sub connectors are available in 5 standard shell sizes with 23 multiple contact arrangements. These reliable, robust combination d-sub connectors allow a combination of signal and coaxial contacts in cable mount, vertical board mount & right angle board mount termination type variations.


Coaxial D-SUB Mixed Contact Solder Cup
Features
Coaxial d-sub for a variety of applications in cable mount.
Signal contacts come pre-loaded. Coaxial contacts supplied - Not Pre-Loaded.

Available in 5 standard shell sizes with 23 multiple contact arrangements: 1W1/ 2V2 /2W2 /3V3/ 3W3/ 5W1/ 5W5

/ 7W2/ 8W8/ 9W4/ 11W1/ 13W3/ 13W6 /17W2/ 17W5 /21W1/ 21W4/ 24W7/ 25W3 /27W2/ 36W4/ 43W2/ 47W1

Allows combination of signal and coaxial d-sub contacts.

Materials
Shell: Steel, nickel plated
Insulator: PBT + 30% fiber-glass - Black, U.L. rated 94V-O
Contacts: Brass - Gold flash over nickel

Notes
Panel Cut-Outs
5W1 = Standard 9 Pin Shell
3W3 / 3W3K / 7W2 / 11W1 = Standard 15 Pin Shell
5W5 / 9W4 / 13W3 / 17W2 / 21W1= Standard 25 Pin Shell
8W8 / 21WA4 = Standard 37 Pin Shell
Other Contact Arrangements Available Upon Request.

Coaxial D-Sub Connector, Coaxial D-Sub with Mixed Layout, Coaxial D-Sub with Mixed with Full Layout,Coaxial D-Sub Male, Coaxial D-Sub Female

ShenZhen Antenk Electronics Co,Ltd , https://www.antenkwire.com