On February 23, 2014, the New Year Forum hosted by Gaogong LED, LED Lighting E-Commerce and Supply Chain Integration Summit was held in the Manjiang Red Hall on the third floor of Shangri-La Hotel, Pazhou, Guangzhou. In the afternoon, LED lighting supply chain good product tour specials came from Corporate guests such as Mulinsen, Yuanda Electronics, Overclocking III, Jingtai Optoelectronics, Jiehuate and Incentive Testing gave a keynote speech on how to control supply chain cost control, internal R&D ecosystem and technology development trends in the new market situation. And brought the latest technology and product sharing in the segment to the participants.
Lin Jili, general manager of Mulinsen Lighting, Yang Lixin, deputy general manager of Yuanda Electronics, Wen Kongliang, director of overclocking technology engineering, Zhou Xunwei, general manager of Jiehuate Electronics, Zhang Zhennan, R&D manager of Jingtai Optoelectronics, Li Sheng, general manager of testing and testing, etc. Share from the sub-areas of light sources, power supplies, substrates, cooling kits, and finished product inspection.
“The main function of the package is to protect and improve the reliability of the chip. Therefore, the choice of packaging materials is particularly important.†Zhang Zhennan, R&D manager of Jingtai Optoelectronics, said, “The main components of the bracket are plastic, copper and electroplating, and the latter two. The species is relatively mature, and the possibility of improvement is relatively small, mainly depending on the plastic."
In plastics, PCT performance is better than PPA, and it is also higher than EMC in cost performance, becoming the material of choice for TV backlight and high-power lighting chip packaging.
Lin Jili, general manager of Mulinsen Lighting, Yang Lixin, deputy general manager of Yuanda Electronics, Wen Kongliang, director of overclocking technology engineering, Zhou Xunwei, general manager of Jiehuate Electronics, Zhang Zhennan, R&D manager of Jingtai Optoelectronics, Li Sheng, general manager of testing and testing, etc. Share from the sub-areas of light sources, power supplies, substrates, cooling kits, and finished product inspection.
Jingtai Optoelectronics R&D Manager Zhang Zhennan
“The main function of the package is to protect and improve the reliability of the chip. Therefore, the choice of packaging materials is particularly important.†Zhang Zhennan, R&D manager of Jingtai Optoelectronics, said, “The main components of the bracket are plastic, copper and electroplating, and the latter two. The species is relatively mature, and the possibility of improvement is relatively small, mainly depending on the plastic."
In plastics, PCT performance is better than PPA, and it is also higher than EMC in cost performance, becoming the material of choice for TV backlight and high-power lighting chip packaging.
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