Today, CSP strong winds stir the entire LED packaging market, which is leading a major change in the current LED lighting industry.
There is no doubt that CSP will be the final trend.
In fact, in recent years, as downstream lighting application customers love high-efficiency, high reliability, and low-cost products, the demand for LED packaging products has also increased.
In this context, Simai completed the development of this new product in N-CSP 1919 in April 2016.
According to the relevant person in charge of Simai, “This new product reduces the production cycle of the product by using the flip chip bonding technology, which reduces the production cycle of the product and effectively reduces the cost; In addition, because the size of the NCSP package is greatly reduced, the high optical density is closer to the point light source, the luminaire design is more flexible, the structure is compact and simple, and the application end brings greater convenience.
Most importantly, in terms of performance, due to the small light-emitting surface of the NCSP, high optical density characteristics, easy optical directivity control, the electrode design of the flip chip is used to make the current distribution more balanced, suitable for larger current drive.
NCSP-LED device package cross-section
The core technology and innovations adopted in this project are
1. With unique bracket design, different types and models of chips can be placed flexibly and flexibly; both NCCS products for flip-chip and inverted flip-chip NCSP products can be realized.
2. Unique product pad design, which facilitates the identification of positive and negative electrodes, while avoiding the short circuit that occurs when SMT is mounted.
3. Using the unique EMC bracket design structure, our NCSP products can be realized by using the existing LED dispensing process on the coating of fluorescent glue.
Some customers' evaluation of products
1. CSP can be directly applied to the PCB, which effectively shortens the heat flow path from the heat source to the substrate and reduces the thermal resistance of the light source.
2. The size of the CSP light source becomes smaller, and the optical density becomes higher, which simplifies the difficulty of secondary optical design.
3. Since the LED module has considered the problems of electronics, electricity, primary heat dissipation and primary light distribution, LED lamp manufacturers only need to consider the structure of the lamp, secondary heat dissipation and secondary light distribution, thus reducing the threshold of the LED lamp factory. , reducing the research and development costs of LED lighting.
4. The CSP package solder-free wire also solves the hidden danger of product failure due to the unreliable bonding wire, and the reliability of the product is further improved.
About Smed
Shenzhen Simai Semiconductor Co., Ltd. specializes in the research, development, production and sales of various types of EMC/SMC LED 3030, 5050, 7070, SMD LED 2835, COB and other national high-tech enterprises.
The company has more than 15,000 square meters of clean room, more than 1,000 employees, monthly capacity of 3,500 KK. It is one of the few packaging companies that can mass produce EMC/SMC brackets. And the ISO9001:2008, ISO/TS16949:2009 quality management system is used, and the ISO14001:2004 environmental system certification is also awarded.
Products are widely used in LED fluorescent lamps, LED bulbs, LED panel lights, LED street lights, LED indoor lighting, TV backlight and other fields, mainstream products have passed the IES LM-80 test. In 2015, it became the most competitive LED lighting source and solution provider in China.
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