
Researchers at the University of California, Berkeley, funded by the National Semiconductor Research Consortium, have developed a new type of inductor manufacturing technology—a miniature inductor made from insulated nano-composite magnetic materials that can dramatically improve the performance of high-frequency on-chip inductors. At the same time reduce its physical size. The advent of this technology is expected to trigger a wave of change in miniaturized electronic devices and wireless communication devices.
Inductance is the most basic passive component in the circuit. How to miniaturize on-chip inductors while maintaining their inductance and performance has always been a problem for scientists. In order to obtain sufficient inductance, the on-chip inductance often needs to be in the range of hundreds of micrometers or millimeters, and the parasitic effect between the spiral coil and the semiconductor substrate will bring about loss. Research by researchers at the University of California, Berkeley, has solved this problem. Test results show that this new type of inductive performance is increased by 80% while the physical size is reduced by 50%. In addition, this new inductor manufacturing technology can also extend the operating frequency range currently limited by eddy current losses.
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